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Quantum Compute Wafer and Device Characterization Engineer

Western Digital Technologies, Inc. · San Jose, CA · posted 8 days ago

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94
Certified filings · by Western Digital Technologies, Inc., FY2026 Q2
$146,758
Median filed wage · across all this employer’s sponsored roles

Source: US DOL Office of Foreign Labor Certification, LCA disclosure data, FY2026 Q2. Government data is published roughly one quarter in arrears.

No single filed job title matched this advert closely enough, so the figure above is Western Digital Technologies, Inc.’s median across every role it sponsored.

The figure above is not this job’s salary. It is what Western Digital Technologies, Inc. reported to the US Department of Labor for the closest role it has sponsored. A filing history means this employer has sponsored before — it is not a promise that this opening carries sponsorship, and not an offer of pay. Check the advert and ask the employer.

See every role Western Digital Technologies, Inc. has sponsored, and what it paid →

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The role, as Western Digital Technologies, Inc. describes it

We are seeking a talented researcher to join our team and drive innovative research projects in quantum computing, specifically to focus on quantum compute wafer level characterization. The key emphasis of this role will be detailed surface, interfaces and thin film materials characterization required for the superconducting qubit nanofabrication project, across a wide spectrum of superconducting materials and various insulating films. The overarching goal of the project is to translate exceptional process uniformity abilities in Western Digital into exceptional resonator and qubit performance uniformity across the wafer, and from wafer to wafer. In the course of the project, you will collaborate with nanofabrication scientists working on device nanofabrication, electrical characterization team focused on quantum characterization of devices, device designers and thin film deposition experts. Successful candidates are expected to have deep familiarity with variety of thin film characterization techniques allowing them to operate independently and with high throughput, as well as prior familiarity with superconducting qubit device designs and potential material systems.

ESSENTIAL DUTIES AND RESPONSIBILITIES - Lead and execute research projects in quantum computing wafer and device level characterization, collaborating with other team members and utilizing internal and external characterization techniques and resources

  • Lead effort in thin film materials stack characterization and resonator and qubit device room temperature characterization utilizing various surface and interface characterization techniques
  • Collaborate with product teams to tackle novel challenges and develop innovative solutions.
  • Collaboration: Stay current with industry and academic trends, publishing papers and presenting at conferences.
  • Reporting: Develop and present detailed reports and visualizations to communicate findings, trends, and actionable insights to stakeholders at all levels.
  • Motivation: Highly self-motivated problem solver able to thrive in unstructured environment. Ability to independently pursue fundamental research, including paper writing and publishing.
  • Communication: Excellent written and verbal communication skills, with the ability to present complex data and insights clearly to both technical and non-technical audiences.
  • Analytical Skills: Demonstrated ability to quickly grasp and address challenges outside of immediate field of expertise.

Required: - Ph.D degree and post-doctoral experience in Physics, Electrical Engineering, Materials Science with focus on thin film characterization, as well as surface and interfaces characterization of thin film materials stacks for superconducting qubits

  • Thorough understanding of superconducting qubit design
  • Experience in nanofabrication methods for superconducting qubits is a plus
  • Experience in thin film materials characterization including XRD, AFM, CIPT, SEM, cross-sectional TEM, XPS, AES, ESCA, TOF-SIMS and other
  • Proficiency in a wide array of programming languages, like Python, Rust, TCL, or C, and the ability to choose the right one for the task, including knowledge (or willingness to acquire knowledge) of FPGA based microcontrollers

WD is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disabil

Read the full advert and apply on Western Digital Technologies, Inc.’s site →

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