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Senior PCB Design Engineer

Arista Networks, Inc. · Santa Clara, CA · posted 6 weeks ago

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56
Certified filings · by Arista Networks, Inc., FY2026 Q2
$107,851
Median filed wage · for “Senior Technical Solutions Engineer” · 1 filings

Source: US DOL Office of Foreign Labor Certification, LCA disclosure data, FY2026 Q2. Government data is published roughly one quarter in arrears.

This advert was matched to Senior Technical Solutions Engineer, a job title Arista Networks, Inc. has itself sponsored.

The figure above is not this job’s salary. It is what Arista Networks, Inc. reported to the US Department of Labor for the closest role it has sponsored. A filing history means this employer has sponsored before — it is not a promise that this opening carries sponsorship, and not an offer of pay. Check the advert and ask the employer.

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The role, as Arista Networks, Inc. describes it

Who You’ll Work With Working closely with cross-functional teams including Hardware Design, Signal Integrity (SI), Power Integrity (PI), Mechanical Engineering, Thermal Engineering, and Manufacturing, our engineers innovate on system architectures and ultra-high-speed PCB designs to deliver state-of- the-art networking platforms. What You'll Do Our Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in enterprise campuses, hyperscale datacenters, and next-generation AI clusters. The team is responsible for end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments — including optical interface platforms up to 800G and 1.6T. Core Responsibilities High-Speed Layout & Routing - Implement complex routing for advanced interfaces such as 112G/224G SerDes, PCIe Gen 5/6, DDR4/5/6

  • Design and route high-speed differential pairs with tight skew and impedance control
  • Execute dense BGA fan-out for high-pin-count ASICs and FPGAs

Optical Transceiver PCB Layout (800G / 1.6T) - Design and layout boards supporting high-bandwidth optical transceivers (QSFP-DD, OSFP, OSFP-XD or equivalent)

  • Route 112G / 224G PAM4 electrical channels between switch ASICs and optical modules
  • Define insertion loss budgets and coordinate with SI engineers to meet IEEE compliance requirements
  • Optimize breakout routing beneath high-density optical cages
  • Implement via stub mitigation strategies including backdrilling for ultra-high-speed signal paths
  • Manage ground reference continuity, EMI control, and return path integrity near optical connectors
  • Consider thermal dissipation (20W–30W+ modules) in layout planning
  • Impedance Control & Signal Integrity
  • Design advanced multi-layer stack-ups (20–30+ layers)
  • Calculate impedance profiles and ensure low-reflection, low-crosstalk performance
  • Collaborate with SI teams on channel modeling and pre-/post-layout simulations
  • Power Integrity (PI) Optimization
  • Design robust Power Distribution Networks (PDNs) for high-current ASICs
  • Layout multi-phase DC/DC converters for high transient loads
  • Strategically place decoupling capacitors to ensure wideband impedance stability
  • Thermal & Mechanical Coordination
  • Integrate thermal vias, heat sink attachments, and high-conductivity materials
  • Coordinate mechanical constraints such as enclosure, airflow, and structural limitations
  • Ensure proper placement and structural integration of optical cages
  • Advanced Fabrication Deliverables
  • Generate comprehensive manufacturing packages (Gerber, ODB++, IPC-2581)
  • Define backdrilling parameters and impedance specifications
  • Ensure compliance with DFM, DFA, and DFT requirements
  • Support boards through fabrication, assembly, and production ramp
  • Library & Feasibility Ownership
  • Create and maintain high-density component footprints (e.g., large BGAs, optical module connectors)
  • Participate in new product feasibility studies
  • Develop detailed routing guidelines and work packages for layout partners
  • Review external placement and routing work to ensure quality and schedule adherence
  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or related field
  • 10+ years of relevant hardware engineering experience
  • Proven experience designing networking hardware, particularly involving 100G/200G PAM4 Ethernet switching
  • Direct experience in high-speed optical transceiver PCB layout (800G and/or 1.6T preferred)
  • Expertise with 112G / 224G PAM4 routing and channel optimization
  • Advanced proficiency in Cadence Allegro and Sigrity
  • Experience designing 20+ layer boards with 50G+ signals
  • Hands-on experience with sequential lamination, HDI, ultra-low-loss materials
  • Experience in multi-phase DC/DC layout for high-current, high transient loads
  • Strong manufacturing knowledge including DFM, DFA, and DFT for 30+ layer rigid and rig

Read the full advert and apply on Arista Networks, Inc.’s site →

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